Snapdragon 8 Gen 2移動平台

Qualcomm® Artificial Intelligence (AI) Engine

GPU Name:Qualcomm® Adreno™

CPU Name:Qualcomm® Kryo™

Qualcomm® Hexagon™ Processor Features:Qualcomm® Hexagon™ Tensor Accelerator,Dedicated power delivery system,Qualcomm® Hexagon™ Scalar Accelerator,Qualcomm® Hexagon™ Vector eXtensions (HVX),Micro Tile Inferencing,Fused AI Accelerator architecture,Hexagon Direct Link

Qualcomm® Sensing Hub Features:Dual-core AI processor,Always-sensing camera

CPU

Name:Qualcomm® Kryo™

Architecture:64-bit

Clock Speed:Up to 3.36 GHz

GPU

Name:Qualcomm® Adreno™

APIs:Vulkan® 1.3,OpenGL® ES 3.2,OpenCL™ 2.0 FP

Cellular Modem-RF

Modem Name:Snapdragon™ X70 5G Modem-RF System

Peak Download Speed:Up to 10 Gbps

Peak Upload Speed:Up to 3.5 Gbps

Cellular Modem-RF Specs:8 carriers (mmWave),2x2 MIMO (mmWave),4x4 MIMO (Sub-6)

Performance Enhancement Technologies:Qualcomm® Smart Transmit 3.0 technology,Qualcomm® AI-Enhanced Signal Boost,Qualcomm® 5G Ultra-Low Latency Suite,Qualcomm® Wideband Envelope Tracking,Qualcomm® 5G AI Suite,Qualcomm® 5G PowerSave Gen 3

Cellular Technology:TD-SCDMA,HSPA,sub-6 GHz,FDD,5G mmWave,NSA (non-standalone),CDMA 1x,EN-DC,EV-DO,CBRS,NR-DC (mmWave-sub6 dual connectivity),TDD,LTE,GSM/EDGE,SA (standalone),SA (standalone) mmWave,WCDMA

Multi SIM:Dual SIM Dual Active (DSDA) 5G 5G and 5G 4G,Global 5G Multi-SIM

Wi-Fi

Wi-Fi/Bluetooth System:Qualcomm® FastConnect™ 7800

Peak Speed:Up to 5.8 Gbps

Generation:Wi-Fi 4,Wi-Fi 6,Wi-Fi 5,Wi-Fi 7

Standards:802.11a,802.11b,802.11g,802.11n,802.11ac,802.11ax,802.11be

Spectral Bands:6 GHz,2.4 GHz,5 GHz

Channels:320 MHz

Peak QAM:4K QAM

Features:Passpoint,TDLS,High Band Simultaneous (HBS) Multi-Link,Wi-Fi QoS Management,Wi-Fi Optimized Connectivity,MU-MIMO (UL/DL),Wi-Fi Aware R3,Wi-Fi Location,OFDMA (UL/DL),Miracast,Voice-Enterprise

Bluetooth

Wi-Fi/Bluetooth System:Qualcomm® FastConnect™ 7800

Specification Version:Bluetooth® 5.3

Topologies:Dual Bluetooth® Radios

Low Energy Features:Bluetooth® Low Energy Audio

Location

Location Support:Qualcomm® Location Suite

Satellite Systems:GLONASS,NavIC,Beidou,GPS,QZSS,Galileo

Frequency Support:Triple

Accuracy:Lane-level,Sidewalk-level

Features:Global Freeway Vehicle Navigation,Concurrent satellite systems,Pedestrian Navigation

NFC

Near Field Communications:Supported

Camera

Image Signal Processor (ISP) Name:Qualcomm® Spectra™

Image Signal Processor (ISP) Type:Hardware Accelerator for Computer Vision (CV-ISP),Cognitive ISP (Cog ISP),Image Signal Processor (ISP)

Image Signal Processor (ISP) Number:Triple ISP

Image Signal Processor (ISP) Bit Depth:18-bit

Single Camera (MFNR, ZSL, 30 fps):Up to 108 MP

Single Camera:Up to 200 MP

Features:AI-based auto-exposure,AI-based auto-focus,Mega Low light photography,Engine for Visual Analytics 3.0,Multi-frame Noise Reduction (MFNR),AI-based face detection,Locally Motion Compensated Temporal Filtering (MCTF),Real-time Semantic Segmentation

Video Capture:Up to 8K 30fps or 4K 120fps video capture

Slow Motion Video Capture:Up to 720p @ 960 fps

Video Capture Formats:Hybrid Log Gamma (HLG),Dolby Vision®,HDR10,HDR10

Video Capture Features:Engine for Visual Analytics 3.0,Up to 4 exposures (with QDOL image sensors),Video super resolution,Computational HDR with staggered imaged sensors,Real-time Semantic Segmentation,Bokeh Engine (version 2)

Video Playback

Resolution:Up to 8K @ 60 fps

Codecs:Hybrid Log Gamma (HLG),HDR10 ,AV1,H.264 (Advanced Video Coding (AVC)),VP9,VP8,Dolby Vision®,H.265 (High Efficiency Video Coding (HEVC)),HDR10

Features:HDR Vivid

Display

Maximum On-Device Display Resolution:4K Ultra HD @ 60 Hz,QHD @ 144 Hz

Maximum External Display Resolution:4K @ 60 Hz

High Dynamic Range (HDR):HDR Vivid,HDR10 ,HDR10

Color Depth:Up to 10-bit

Color Gamut:Rec. 2020

Audio

Qualcomm Aqstic™ technology support:Qualcomm Aqstic™ audio codec,Qualcomm Aqstic™ smart speaker amplifier

Qualcomm® aptX™ audio technology support:Qualcomm® aptX™ Voice,Qualcomm® aptX™ Adaptive,Qualcomm® aptX™ Lossless

Audio Processing Technologies:Snapdragon Sound™ technology

Charging

Qualcomm® Quick Charge™ technology support:Qualcomm® Quick Charge™ 5 technology

Security

Fingerprint Sensor:Qualcomm® 3D Sonic Sensor Max,Qualcomm® 3D Sonic Sensor

Secure Processing Unit (SPU):Biometric Authentication (Face),Biometric Authentication (Fingerprint),Biometric Authentication (Voice),Biometric Authentication (Iris)

Features:Qualcomm® Trusted Execution Environment (TEE),Trust Management Engine,Qualcomm® Wireless Edge Services (WES),Qualcomm® Type-1 Hypervisor,Platform Security Foundations,Secure Processing Unit (SPU)

Memory

Speed:4200 MHz

Type:LPDDR5x

Development Software

Artificial Intelligence (AI):Qualcomm® AI Stack

Interfaces

Supported Interfaces:USB-C,USB 3.1

Universal Serial Bus (USB)

Interface Type:USB-C

Specification Version:USB 3.1

Process Node and Technology

Process Node:4 nm

Part

Part Number(s):SM8550-AB

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