[硬件]導熱墊(Thermal Pad)和導熱過孔(Via for thermal pad)_清涼簡裝的博客-CSDN博客

什麽是導熱墊，導熱過孔？

PCB散熱墊中的散熱孔通常用於將熱量從器件傳導出去，竝有傚地將熱量從PCB的頂部銅層傳遞到內部或底部銅層或外部環境。

Thermal vias in the PCB thermalpad are typically used to conduct the heat away from the device and to transfer effectively the heat from the top copper layer of the PCB to the inner or bottom copper layer or to the outside environment.

This paper discusses our study on the impact of the via size and the via design on QFN voiding and solder protrusion.
Do small vias prevent the solder from flowing onto the other side? How should via be designed? Which via type will have less voiding issue? A comprehensive experiment was designed in trying to answer these questions. Different QFN types, via design, via sizes, via pitches and stencil design were studied using three different board thicknesses: 1.6mm, 2.4mm and 3.2 mil thick.

ESP32的導熱過孔

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